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FormFactor, Inc.

Sr Manager, RF Design

RemoteUnited States only· except Albania, AK, Argentina +25 more
Published
Role
Design
Experience
Lead
Employment
Full-time
Company size
Enterprise
$138.9k–$182.3k/yr
Check eligibility

Open to US only · except AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. Set where you work from to check your eligibility.

No BS summary

Senior Manager for RF Probe Card Design team. Requires 8+ years in semiconductor test/RF product development and 3+ years in engineering leadership. Must lead design, drive technical excellence, and manage a team of designers. Experience with RF/microwave design principles and semiconductor wafer probing is essential.

Core skills

RF Microwave DesignTeam LeadershipRF Probe Card Design

Required skills

RF SimulationsATE TestingContinuous ImprovementCross-Functional CollaborationDesign MethodsEngineering ManagementLean MethodologiesPCB Layout DesignRF probe cardsRF interposerstest interfacessubstratessemiconductor test hardwarePCBthin-filmceramicadvanced substrate technologiesSMT manufacturing processengineering design methodologiesstandardsbest practicesdesign automationdesign productivity improvementsDFMEAPFMEAIshikawaroot-cause analysiscorrective action methodologiesLean ManufacturingSix SigmaDOESPCGage R&R principles

What you'll do

  • Lead, coach, and develop a team of RF Probe Card Designers.
  • Establish team goals, performance expectations, and individual development plans.
  • Recruit, hire, mentor, and retain high-performing technical talent.
  • Foster a culture of accountability, accuracy, innovation, continuous improvement, and collaboration.
  • Develop succession plans and support career growth opportunities for team members.
  • Direct the production design of RF and microwave probe card solutions
  • Provide technical leadership for the design of complex RF probe card architectures, transmission line structures, and probe technologies.
  • Continuously evaluate and improve RF probe card design methodologies, design tools, design rules, and workflows.
  • Establish and maintain design metrics and utilize data-driven decision-making to identify opportunities for process and methodology improvements.
  • Drive design standardization, methodology development, design reuse, and best practices across product families and FormFactor sites to improve quality, cycle time, and efficiency.
  • Collaborate with RF/SI engineering, measurement, applications engineering, and product engineering teams to optimize electrical and mechanical performance.
  • Balance design resources to meet delivery, quality, cost, and performance objectives.
  • Manage multiple complex development projects simultaneously through various stages of the product lifecycle.
  • Ensure on-time completion of design milestones, design reviews, and product releases.
  • Provide project status, resource planning, and performance metrics to management.
  • Collaborate closely with Product Engineering, Mechanical Engineering, Manufacturing Engineering, Operations, Supply Chain, Quality, and Product Management teams.
  • Drive seamless transfer of new products from development into production design.
  • Champion Design for Manufacturability (DFM) and Design for Assembly (DFA) principles.
  • Lead technical investigations and corrective actions for customer-impacting issues.
  • Partner with cross functional leadership to establish robust SIOP processes.
  • Own and continuously evolve RF probe card design methodologies to improve quality, predictability, scalability, and design cycle time.
  • Drive implementation of design automation, parametric design techniques, CAD tool enhancements, and workflow improvements.
  • Establish and maintain design standards, design rules, templates, libraries, and best practices.
  • Lead initiatives to reduce design iterations, improve first-pass design success rates, and enhance manufacturability.
  • Develop KPIs and performance metrics to measure effectiveness of design processes and continuous improvement initiatives.
  • Utilize Lean, Six Sigma, root-cause analysis, and other structured problem-solving methodologies to eliminate recurring design and product quality issues.
  • Lead change management activities related to design methodologies, design rules, CAD tools, and engineering workflows.

What they require

  • Minimum 8 years of experience in semiconductor test, RF product development, probe cards, advanced interconnect technologies, microelectronics, PCB design, or related industries.
  • Minimum 3 years of engineering leadership, technical leadership, or people management experience.
  • Demonstrated success leading cross-functional development projects from concept through production release.
  • Experience managing technical professionals and building high-performing teams.
  • Experience in semiconductor wafer probe, RF test systems, or advanced packaging technologies.
  • Experience leading global engineering teams and cross-site development activities.
  • Bachelor's degree in Electrical Engineering, Physics, or related engineering discipline.
  • Minimum of 10 years of related experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years experience; or equivalent work experience
  • Strong understanding of RF, microwave, and high-speed electrical design principles.
  • Understanding of PCB, thin-film, ceramic, advanced substrate technologies.
  • Understanding of SMT manufacturing process.
  • Demonstrated experience developing and implementing engineering design methodologies, standards, and best practices.
  • Experience driving design automation and design productivity improvements.
  • Working knowledge of DFMEA, PFMEA, Ishikawa, IS/IS NOT, root-cause analysis, and corrective action methodologies.
  • Familiarity with Lean Manufacturing, Six Sigma, DOE, SPC, and Gage R&R principles.
  • Excellent problem-solving and decision-making skills.
  • Strong written and verbal communication skills.

Benefits

  • medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off.
  • quarterly profit-sharing bonuses
  • flexible spending or savings accounts.

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test.

SemiconductorEnterprise
$138.9k–$182.3k/yr